Category Archives: Electric Electronics

Electric Electronics

Enhanced Flexibility for Service Technicians: tde“s New MPO Patch Cords Allow for Easy and Fast Gender and Polarity Switching

Network expert expands portfolio by MPO patch cords equipped with MTP Pro Connector from US Conec

Enhanced Flexibility for Service Technicians: tde"s New MPO Patch Cords Allow for Easy and Fast Gender and Polarity Switching

(Source: tde – trans data elektronik GmbH)

Dortmund, 22th November 2017. Effective immediately, tde is now offering clients MPO patch cords equipped with the new MTP Pro Connectors manufactured by US Conec. This product“s special feature is its capability to perform quick and easy gender and polarity switches, while maintaining the high performance level of the connector. Thanks to the new MTP Pro patch cord it is possible for service technicians to work more flexibly in regards to cabling infrastructure. Also, the service technician need not carry all connector varieties with him on-site. Even infrastructures with a 40/100 G connection can be configured more versatilely on site using the pre-existing cabling and the right patch cord. tde ships the new MTP Pro patch cord with a cable construction which the company is well known for. It protects the loose tube with a sturdy internal tube. The MTP Pro patch cords are now available in the configurations 12-Fibre and 24-Fibre MPO as single mode in OS2 as well as in multimode with the fibre types OM3 and OM4.

The portfolio of the network specialist tde – trans data elektronik GmbH now includes MPO patch cords equipped with the new MTP Pro Connectors manufactured by US Conec. These connectors can be converted from male to female without any prior experience and only with a specialist tool. With the use of the specialist tool, changing polarity from Type A to Type B or vice-versa is quickly achieved. This means maximum flexibility for service technicians. It enables them to react to any kind of cabling infrastructure. Even when technicians often install or remove MTP Pro guide pins, it does not negatively impact the performance of the connectors – another unique characteristic.

Ideal as measurement cable or for 40/100G connections

Patch cords with the new MTP Pro Connectors are especially suited for the use as measurement cable: Service technicians no longer need a variety of cables on hand while on site and are still prepared for any cabling infrastructure. The patch cords also reveal their advantages in context of 40/100 G connections: They can be flexibly configured with the already existing cabling on site.

tde offers the new MTP Pro patch cords equipped with the proven cable construction the company is well known for: It utilises a sturdy inner tube to give optimal protection to the loose tube.

The MTP Pro patch cords are now available in the configurations 12-Fibre and 24-Fibre MPO as single mode in OS2 or as multi mode in the fibre types OM3 and OM4.

The tde-owned tML system platforms works independently from the MTP Pro patch cord: „The greatest advantage of our tML-System is that our clients do not have to waste a single thought on the gender or polarity of MPO-connections,“ explains Andre Engel, CEO of tde – trans data elektronik GmbH. „For this purpose we have coordinated all of our system components with each other, so that network technicians can work with standardised patch cords, modules and trunk cables before or after migration.“

About tde – trans data elektronik GmbH

For 25 years the tde – trans data elektronik GmbH, an internationally successful company, has specialised in the development and production of scalable cabling systems for highest packing density. The nuclear research centre CERN relies on the know-how of the leading company in multi-fibre technics (MPO) as well. The company“s portfolio „Made in Germany“ contains complete system solutions with a focus on Plug-and-play for high speed applications in the field of datacom, telecom, industry, medical and defence. tde offers both planning and installation services through its own service department and supports the „European Code of Conduct“ when it comes to energy efficiency in data centres. For more information, visit www.tde.de

Company-Contact
tde – trans data elektronik
André Engel
Prinz-Friedrich-Karl-Str. 46
44135 Dortmund
Phone: +49 231 160480
E-Mail: info@tde.de
Url: http://www.tde.de

Press
epr – elsaesser public relations
Frauke Schütz
Maximilianstraße 50
86150 Augsburg
Phone: +49 – (0)821 – 45 08 79 – 16
E-Mail: fs@epr-online.com
Url: http://www.epr-online.com

Electric Electronics

InPrint 2017: Tichawa Vision Presents VTCIS and VDCIS with all new Features

100% quality control for print products with high-precision CIS sensors

InPrint 2017: Tichawa Vision Presents VTCIS and VDCIS with all new Features

The VTCIS detects missing nozzles automatically in the print image at a resolution of 1200 dpi

Friedberg, 17th Oktober 2017. On the 14th till 16th November in Munich, Tichawa Vision GmbH will be introducing not one, but two new innovations during their first showing at the trade fair InPrint. At their booth #254 in Hall A6, the specialist for high-precision CIS sensors will be presenting the VTCIS as well as the internationally acclaimed VDCIS. The industrial scanner streamlined for digital, inkjet and security printing has been equipped with new functions, which automatically recognize missing nozzles at a resolution of 1200 dpi. With its increased operating distance and depth of field, the VDCIS opens up completely new fields of application such as Direct-to-shape Printing and the inspection of strongly profiled surfaces in near 3D quality.

The trade fair InPrint is the ideal venue for Tichawa Vision for introducing their new CIS technologies, which were developed especially for the printing industry. „The demands of industrial printing on paper, metal, plastic and other surfaces are growing while the standards for quality are also continually increasing. Our products are a response to market demands. We develop CIS sensors which come with a 100% quality control guarantee for manufacturers and refiners“, explains Dr. Nikolaus Tichawa, CEO of Tichawa Vision GmbH.

Automatic recognition of missing nozzles at a resolution of 1200 dpi

The VTCIS is capable of automatically detecting missing nozzles in the print image at a resolution of 1.200 dpi. Tichawa has also equipped the VTCIS with the all new feature „Regions of Interest“. The CIS only scans particular section rather than processing the complete image, simplifying data processing and significantly reducing data volume. The integrated liquid cooling guarantees color stability throughout the whole printing process, thereby eliminating color deviations.

The VTCIS is currently market-leading among camera systems for quality control in terms of compactness and scanning speed. Thanks to the remarkable line rate of up to 250 kHz and a scanning speed of up to 20 m/s, the VTCIS is perfectly suited for all very fast running print processes. The optional sensor is available with a reading width of 260 to 1560 Millimeters.

VDCIS impresses with outstanding qualities

The VDCIS, which was awarded Gold during this year“s Vision Systems Innovators Awards, is specially designed for the surface inspection of high profiled surfaces as well as products made of glass, wood, metal, plastics and ceramics. A great improvement is the increase of the operating distance between the sensor screen and the test object from a range of 10 Millimeters to a range of 60 to 80 Millimeters. At the same time, the depth of field has been increased from about 1 Millimeter to 15 Millimeters, enabling the CIS sensor to look deeper. It can, for example, determine whether any pills are missing in the packaging or inspect labels on cans, bottles, cylindrical shapes and other curved surfaces.

Due to its slim and very compact build, companies can easily install the VDCIS into their machinery at minimal expense. The sensor can be equipped with an optional scanning width of 300 to 1.800 Millimeters. The VDCIS is available with adjustable resolution (250 to 1.000 dpi) as well as with the lighting combinations RGB and monochrome (black/white). These groundbreaking features make the VDCIS product line deployable to completely new fields of application, such as Direct-to-Shape Printing or the inspection of strongly profiled surfaces in near 3D quality.

Visit Tichawa Vision at InPrint 2017 in Hall A6, Booth 254.

About Tichawa Vision
Since the foundation in 1991, Tichawa Vision GmbH has specialised in the development, production and distribution of camera technologies for industrial image processing for the purpose of optical surface inspection and product control. Tichawa is the worldwide leader in the field of Contact Image Sensors (CIS), which -consisting of a reading line, an integrated lens and an optimized light source -generate reliable analytical results with an aspect ration of 1:1 for applications as well as glass processing, silk screen printing, wafer inspection, sorting of postal items or automation technology.

epr is an owner-managed agency for press and public relations based in Augsburg. With creative solutions, epr supports local, national and international companies and institutions in building a brand and image. Founded in Augsburg in 2007, the agency offers many years of experience in consulting and implementation of PR and marketing concepts as well as in the area of press and public relations. For further information: www.epr-online.de

Contact
epr – elsaesser public relations
Cornelie Elsässer
Maximilianstraße 50
86150 Augsburg
Phone: +498214508790
Fax: +4982145087920
E-Mail: ce@epr-online.de
Url: http://www.epr-online.de

Electric Electronics

KDPOF Provides Optical Connectivity for Smart Antenna Modules

Presentation of Automotive Gigabit Ethernet POF at IEEE-SA Ethernet & IP @ Automotive Technology Day

KDPOF Provides Optical Connectivity for Smart Antenna Modules

KDPOF provides optical connectivity for Smart Antenna Modules

KDPOF – leading supplier for automotive gigabit connectivity over POF (Plastic Optical Fiber) – now provide their optical connectivity technology for Integrated Smart Antenna (ISA) Modules. An ISA consists of several antennas for signal reception, an Antenna Hub, and an Ethernet connection to the consumers of the antenna signals such as a radio device. If each of the several antennas in a car is routed to its respective ECU with its own cable, soon the complexity will be unacceptable. The Antenna Hub routes all signals from each antenna to an Ethernet network connected to all receptors of the signals. Gigabit Ethernet over POF (GEPOF) is ideally suited for the Ethernet connection due to its natural EMC-free property. „If the roof is not metallic, or has openings, in conventional systems an immense amount of energy is radiated by the coaxial cable that is coupled back into the ISA. This seriously degrades the ISA performance,“ explained Carlos Pardo, CEO and Co-founder of KDPOF. „Replacing the coaxial cable with POF completely solves this issue.“ KDPOF will present their GEPOF technology at IEEE-SA Ethernet & IP @ Automotive Technology Day on October 31 to November 2, 2017 in San Jose, California, United States.

EMC for Gigabit Connectivity

The EMC problem-free link also allows simple re-positioning of the antenna module. Another advantage of optical connectivity for Smart Antenna Modules is the easy integration with current 100 Mbps designs thanks to the host bus of the GEPOF transceiver being „Ethernet compliant“ (SGMII/RGMII). Furthermore, the data link will aggregate various packets such as LTE-A, Wifi, V2x, etc. Last but certainly not least, with the current 100 Mbps BroadReach or 150 Mbps MOST not being sufficient, a 1 Gbps Ethernet link is needed. Going one Gigabit and beyond, GEPOF is futureproof.

KDPOF just announced the sampling of the first automotive grade Gigabit Ethernet POF transceiver KD1053. The KD1053 complies with the new IEEE standard amendment Std 802.3bv™ for Gigabit Ethernet over POF. It fully meets the requirements of carmakers by providing high connectivity with a flexible digital host interface, low latency, low jitter, and low linking time.

About KDPOF

Fabless semiconductor supplier KDPOF provides innovative gigabit and long-reach communications over Plastic Optical Fiber (POF). Making gigabit communication over POF a reality, KDPOF technology supplies 1 Gbps POF links for automotive, industrial, and home networks. Founded in 2010 in Madrid, Spain, KDPOF offer their technology as either ASSP or IP (Intellectual Property) to be integrated in SoCs (System-on-Chips). The adaptive and efficient system works with a wide range of optoelectronics and low-cost large core optical fibers, thus delivering carmakers low risks, costs and short time-to-market.

Company-Contact
KDPOF
Óscar Ciordia
Ronda de Poniente 14 2ºA
28760 Tres Cantos
Phone: +34 91 8043387
E-Mail: ma@ahlendorf-communication.com
Url: http://www.kdpof.com

Press
ahlendorf communication
Mandy Ahlendorf
Schiffbauerweg 5F
82319 Starnberg
Phone: +4981519739098
E-Mail: ma@ahlendorf-communication.com
Url: http://www.ahlendorf-communication.com

Electric Electronics

New tML System Platform: Maximum Packing Density, Simple Assembly

tde presents new rack mount enclosure for challenging network environments

New tML System Platform: Maximum Packing Density, Simple Assembly

(Source: tde – trans data elektronik GmbH)

Dortmund, 28th September 2017. With its new tML system platform, tde – trans data elektronik is expanding its portfolio of high-performance scalable plug-and-play cabling solutions. The latest product of the network specialist is the logical next step in developing reliable, modular tML cabling systems. The new rack mount enclosure is especially easy to assemble and, on a height unit of 19 inches (= 1 height unit), has a mounting capacity of up to eight modules from the product lines tML Standard, tML Xtended and tML 24. In combination with the innovative tML 24, the new rack mount enclosure reaches maximum packing density and is highly flexible when migrating to high transmission rates. The massive packing density, coupled with the fast, tool-free assembly via an extendable tray as well as the snap-in mechanism in the rear are unique in the industry. An optional cover for the front manages and protects the patch cables routing.

Lack of time and space are the problems which data centre operators have to face nowadays. With the newly developed and easy-to-assemble tML system platform, tde has developed a solution which can easily face these challenges: Fully equipped with eight modules, the new 19 inch rack mount enclosure is capable of housing 96x fibre-optic LC duplex ports with 192 fibres, 96x 12-fibre MPO with 1152 fibres or 96x 24-fibre MPO with 2304 fibres. Equipping the rack mount enclosure with 6-fibre MPO, 32-fibre MPO, 72-fibre MPO and even 96-fibre MPO is also possible. Different modules with fibre-optic and copper ports, such as RJ45, can be combined in one individual rack mount enclosure. Older connection technologies such as SC, ST or E2000 can also be integrated.

„The packing density is currently unique in the industry“, explains Andre Engel, CEO of tde. „As the modules can be easily switched and exchanged at any time, the new tML system platform is always the number one choice when high transmission rates such as 40 or 100G and more are required. This is especially the case in combination with our tML 24 system.“ The rear cabling of that specific system is based on the 24-fibre connector. The network expert has used trunk cables and modules of the multiply patented, modular tML cabling system and combined them with MPO 24-fibre connectors for that purpose. In contrast with the structurally identical MPO 12-fibre connector, they offer twice the number of fibres with two rows of 12-fibres each, enabling an even more compact performance with minimal space requirements. „We offer companies an unbeatable system in order to protect their investments while at the same time providing peak performance and flexibility for every feasible application scenario“, says Andre Engel.

Tool-free installation

In order to easily equip the rack mount enclosure, tde designed it as an extendable tray, which can be pulled out at the front or even removed completely. This enables IT employees to easily work on assembling modules and cabling on the rear side. No tools are required for mounting the modules, which are secured via a snap-in lock also functioning as a grounding point. The spring mechanism is located inside of the extendable tray. The tray is guided and locked into place by 19 inch mounting tubes. „While developing the new system platform we paid special attention to tool-free handling. Our goal was to allow for a quick and easy implementation with reduced installation times“, explains Andre Engel.

Integrated cable routing

The new system platform also offers integrated patch cable management and can be combined with an optional front cover to enhance the horizontal cable routing and to protect the ports. The new rack mount enclosure also possesses an integrated cable catch on the rear side. Additional components are not necessary. Users profit from reduced installation times here as well. The new system platform has unlimited backwards compatibility for all tML modules on the market, including tML Standard, tML Xtended and tML 24.

The tML – tde Modular Link-System

tML is a patented, modular cabling system, that consists of the three key components module, trunk cable and rack mount enclosure. All of the system components are to 100 percent produced, pre-assembled and tested in Germany. The on-site plug-and-play installation is very simple and straightforward, especially in data centres, as well as other industrial environments. The centrepieces of the system are the MPO/MTP- and Telco connector cables on the rear side, which make it possible to connect at least six or 12 ports with 10 GbE or GbE performance at once. The fibre-optic and TP modules can be used jointly in one single rack mount enclosure with high port density. tde’s tML cabling system can be acquired as the proven tML standard system as well as in the innovative variants tML Xtended and tML 24 with extremely high scalability and easy migration to higher transmission rates such as 40G and 100G+.

About tde – trans data elektronik GmbH

For 25 years the tde – trans data elektronik GmbH, an internationally successful company, has specialised in the development and production of scalable cabling systems for highest packing density. The nuclear research centre CERN relies on the know-how of the leading company in multi-fibre technics (MPO) as well. The company“s portfolio „Made in Germany“ contains complete system solutions with a focus on Plug-and-play for high speed applications in the field of datacom, telecom, industry, medical and defence. tde offers both planning and installation services through its own service department and supports the „European Code of Conduct“ when it comes to energy efficiency in data centres. For more information, visit www.tde.de

Company-Contact
tde – trans data elektronik
André Engel
Prinz-Friedrich-Karl-Str. 46
44135 Dortmund
Phone: +49 231 160480
E-Mail: info@tde.de
Url: http://www.tde.de

Press
epr – elsaesser public relations
Frauke Schütz
Maximilianstraße 50
86150 Augsburg
Phone: +49 – (0)821 – 45 08 79 – 16
E-Mail: fs@epr-online.com
Url: http://www.epr-online.com

Electric Electronics

LumaSense introduces Bundled Solution for Air-Exchange Analysis with Multipoint Sampler and Doser

Lumasense’s new easy-to-use solution for measuring airflow ventilation and purification efficiency.

LumaSense introduces Bundled Solution for Air-Exchange Analysis with Multipoint Sampler and Doser

Air-Exchange Analysis with Multipoint Sampler and Doser and Photoacoustic Gas Monitor.

SANTA CLARA (CA), Sep 12, 2017 – LumaSense Technologies, Inc., https://www.lumasenseinc.com/ , experts in gas measurement, introduces the Innova 1403 multipoint gas sampler and gas doser for air-exchange and flow analysis.

The bundled system solution includes the Innova 1403, the Innova 1412i Photoacoustic Gas Monitor, and 7650 Application Software. Two variations of the system solution are available: Innova 3750-2 Basic Ventilation System Dual Gas and Innova 3750-5 Basic Ventilation System Multi Gas (for up to 5 different gas compounds).

Does the air diffuser works propper? Do you like to improve the air quality? This ventilation solution is specifically designed to accurately dose tracer gas and quantify its distribution throughout the complex ventilation systems found in modern high energy efficiency buildings, rooms and workplace environments including offices, hospitals, and laboratories.

„Innova products are recognized as the gold standard for indoor air quality measurements. Their unique capabilities measure air exchange and purification efficiency with unparalleled accuracy and allow tracing of minute levels of contaminants,“ explained Gregor Hsiao, LumaSense Gas Product Manager.

Ventilation Monitoring: The Innova 1403 can deliver either SF6 or R124a tracer-gas up to help measure the effectiveness of a ventilation system. The user sets up the sampler and the doser unit by
selecting up to 6 sample channels and 1 out of 3 doser channels.

In an air-exchange analysis system, the doser marks the supply air of the room with a known amount of tracer gas. The sampler system then takes a sample of the return-air from the room and delivers the sample to the 1412i for analysis. While the 1412i performs the analysis, the 1403 takes the next sample from the room. The 7560 software uses the tracer gas concentrations measured by the 1412i to calculate the ventilation system performance based on a few simple user inputs.

Trace gas, ventilation monitoring, photoacoustic analyser and monitoring, gas dosing system – the Innova 1403 is an integral part of a system approach to monitoring and measuring the effectiveness of ventilation systems often found in building materials, passenger cabins, Heating, Ventilation and Air Conditioning (HVAC) solutions, or extraction systems (such as fume hoods). In addition, quantifying air exchange rates and identifying the sources of indoor air pollutants for new green building designs allows for optimizing ventilation for worker health and productivity while maintaining energy efficiency.

About LumaSense Technologies™

LumaSense Technologies, Inc.® is one of the world“s most trusted providers of innovative temperature and gas sensing devices. By applying LumaSense“s proven systems and software, customers in Global Energy, Industrial Materials, and Advanced Technologies markets are able to reduce waste and inefficiency in their processes.
For more information about LumaSense Technologies visit http://www.LumasenseInc.com .

Contact
LumaSense Technologies Inc.
Janelle Coponen
3301 Leonard Court –
95054 Santa Clara, CA
Phone: + 1.906.487.6060
E-Mail: j.coponen@lumasenseinc.com
Url: http://www.lumasenseinc.com

Electric Electronics

ELIV 2017: Automotive Gigabit Ethernet POF Transceiver Available

KDPOF Starts Shipping of KD1053 Samples to Automobile Manufacturers and Suppliers

ELIV 2017: Automotive Gigabit Ethernet POF Transceiver Available

KDPOF starts shipping of the automotive gigabit Ethernet POF transceiver KD1053

KDPOF – leading supplier for automotive gigabit connectivity over POF (Plastic Optical Fiber) – is proud to announce the shipment of the first automotive grade Gigabit Ethernet POF (GEPOF) transceiver KD1053 devices to carmakers and their Tier1 suppliers. The first public demonstration will be at the VDI Congress ELIV „ELectronics In Vehicles“ on October 18-19, 2017 at the World Conference Center in Bonn, Germany. „The production start of our automotive POF transceiver marks a significant milestone on our path to make automotive gigabit Ethernet a reality,“ stated Carlos Pardo, CEO and Co-founder of KDPOF. „It is the first fully integrated automotive transceiver to implement the physical layer of Gigabit Ethernet over POF.“ KDPOF provides comprehensive support equipment such as application notes, reference design, evaluation boards and kits in order to enable users a fast and easy design start. Automotive applications with the KD1053 include 100 Mbps and 1 Gbps Ethernet links such as battery management systems (BMS), inter-domain communications backbones, antenna hubs, autonomous driving, and ADAS with surround view.

The KD1053 fully meets the requirements of carmakers by providing high connectivity with a flexible digital host interface, low latency, low jitter, and low linking time. In addition, it complies with the new standard amendment IEEE Std 802.3bv™ for gigabit Ethernet over POF, defining physical layer specifications and management parameters for automotive, industrial, and home networking applications utilizing POF. The standard amendment responded to the demand for high-speed Ethernet solutions. Plastic optical fiber provides unique capabilities for applications where long link lengths are not required. POF technology outplays copper solutions not only in electromagnetic compatibility and immunity, but also provides galvanic isolation, lower weight, and low cost.

About KDPOF

Fabless semiconductor supplier KDPOF provides innovative gigabit and long-reach communications over Plastic Optical Fiber (POF). Making gigabit communication over POF a reality, KDPOF technology supplies 1 Gbps POF links for automotive, industrial, and home networks. Founded in 2010 in Madrid, Spain, KDPOF offer their technology as either ASSP or IP (Intellectual Property) to be integrated in SoCs (System-on-Chips). The adaptive and efficient system works with a wide range of optoelectronics and low-cost large core optical fibers, thus delivering carmakers low risks, costs and short time-to-market.

Company-Contact
KDPOF
Óscar Ciordia
Ronda de Poniente 14 2ºA
28760 Tres Cantos
Phone: +34 91 8043387
E-Mail: ma@ahlendorf-communication.com
Url: http://www.kdpof.com

Press
ahlendorf communication
Mandy Ahlendorf
Schiffbauerweg 5F
82319 Starnberg
Phone: +4981519739098
E-Mail: ma@ahlendorf-communication.com
Url: http://www.ahlendorf-communication.com

Electric Electronics

ERS appoints seasoned expert to fill new CSMO position

ERS appoints seasoned expert to fill new CSMO position

New Chief Sales and Marketing Officer at ERS electronic GmbH: Laurent Giai-Miniet (Source: Laurent Giai-Miniet)

MUNICH, 18 July, 2017 – Effective immediately, Laurent Giai-Miniet is the new Chief Sales and Marketing Officer (CSMO) at ERS electronic GmbH, the world leading provider of thermal test solutions for semiconductor manufacturing.

Laurent Giai-Miniet brings more than 25 years of experience in the semiconductor, global electronics and Internet of Things spaces. Laurent has held leadership positions at companies such as Texas Instruments and Infineon. In one of his most recent roles as CEO, Laurent Giai-Miniet successfully completed the turnaround of the energy harvesting technology leader EnOcean from a German-centric startup to a leading global provider of self-powered IoT solutions.

Laurent“s primary task will be to accelerate the company growth and increase its visibility in the global semiconductor equipment market. „I am excited to join the ERS team and I look forward to building on the foundations of a strong customer base, a talented team and a world-class product to take ERS“s business to the next level“, said Laurent Giai-Miniet.

„Laurent has an impressive track record of growing and scaling businesses“, said Klemens Reitinger, CEO of ERS electronic GmbH. „He brings with him excellent connections from across the worldwide semiconductor industry and a very good understanding of the specific needs and challenges of a growing company like ERS. I am very pleased to be working with him and to further build ERS“s business.“

Laurent holds an MBA (DESS) from the Institut d’Administration des Entreprises (IAE) of Aix-en-Provence (France) as well as an MSc in Technical Marketing of Measurement Instrumentation.

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for more than 45 years. The company has gained an outstanding reputation in this sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS with its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all large-size wafer probers right across the chip industry.

Company-Contact
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
Phone: +49-89-8941320
E-Mail: kreitinger@ers-gmbh.de
Url: http://www.ers-gmbh.com

Press
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
Phone: 08807 9475642
E-Mail: ERS@brandandimage.de
Url: http://www.brandandimage.de

Electric Electronics

A New Way of Looking at Data Centers: Visually Mapping tde“s tML Cabling Systems with AixBOMS

tde’s tML-products can now be managed via the network documentation software AixBOMS

A New Way of Looking at Data Centers: Visually Mapping tde"s tML Cabling Systems with AixBOMS

(Source: tde – trans data elektronik GmbH)

Dortmund / Aachen/GERMANY, 11. July 2017. tde – trans data elektronik GmbH“s tML products are now available under AixBOMS. AixpertSoft made it possible by integrating tde“s modular Plug & Play tML cabling systems into its own software for cable and connection management. tde solutions can now be visually mapped in network documentation and, to a degree, managed automatically. Data center operators benefit from the standardized documentation and management of information required for planning, operation and invoicing of networks and IT inventory management. As of this year, AixpertSoft is a technological partner of this year“s tde-Roadshow „Up to Terabit Mountains – Network (R)Evolution“. During the LANline Tech Forum in Stuttgart on July 11th tde“s booth will be located near the AixpertSoft booth.

tde“s Plug & Play modular tML cabling systems distinguish themselves with their high packing density, a crucial criteria for migrating to higher transmission rates. However, this means there is little space left on the patch panel for port documentation. Even numbering is hard to fit on the plate. „In the years to come, a shortage of space due to a rising number of ports and growing port density will be more and more of an issue“, Andre Engel, CEO of tde predicts. „To deal with these complexities, electronic network documentation solutions like AixBOMS are very useful. We are therefore pleased to announce that AixpertSoft have extended their professional application to include our products.“ With AixBOMS, network technicians and data center operators can visualize all solutions and applications installed in their data center. It makes undecipherable and crowded labels on patch panels or ports a thing of the past.

Clear overview over all levels from data center to port

AixpertSoft developed their software AixBOMS specifically for the cable and connection management demanded by modern IT infrastructures. The software is high-performing, safe, and easy-to-use. Data center operators receive an expert system for planning, documenting and operating the complex IT infrastructures of entire data centers. For cable management, AixBOMS supports a large number of graphic editors, including those for sites, buildings and floor levels, as well as components and spot-on ports for cabinets and connections. Additional features are the unique planning mode and project viewing for the Change Management with automated workflow. Dashboards enable fast access to information in patch nodes and quick searches for technology. AixBOMS offers to establish connections without cables and supports tabular mass data maintenance.

The integration of tML solutions into AixBOMS allows for a visual representation of the network on data center level as well as on port level. At the same time, automatization is possible. In this manner, every connection in the network can be documented, creating an inventory. Various parameters such as length and absorption can be logged and the energy consumption and temperature of all the devices used in the data center managed.

Technological partner of the tde-Roadshow

Technological partner AixpertSoft is a regular guest at the tde-Roadshow events to give lectures on the challenges and trends of software supported IT infrastructure. The close partnership with tde is substantiated by the position of AixpertSoft“s booth at the next LANline event in Stuttgart on July 11th: Both network experts will present their companies in booths in close proximity to each other.

About tde – trans data elektronik GmbH

For 25 years the tde – trans data elektronik GmbH, an internationally successful company, has specialised in the development and production of scalable cabling systems for highest packing density. The nuclear research centre CERN relies on the know-how of the leading company in multi-fibre technics (MPO) as well. The company“s portfolio „Made in Germany“ contains complete system solutions with a focus on Plug-and-play for high speed applications in the field of datacom, telecom, industry, medical and defence. tde offers both planning and installation services through its own service department and supports the „European Code of Conduct“ when it comes to energy efficiency in data centres. For more information, visit www.tde.de

Company-Contact
tde – trans data elektronik
André Engel
Prinz-Friedrich-Karl-Str. 46
44135 Dortmund
Phone: +49 231 160480
E-Mail: info@tde.de
Url: http://www.tde.de

Press
epr – elsaesser public relations
Frauke Schütz
Maximilianstraße 50
86150 Augsburg
Phone: +49 – (0)821 – 45 08 79 – 16
E-Mail: fs@epr-online.com
Url: http://www.epr-online.com

Electric Electronics

New at ZETTLER electronics: 35 AMP Miniature Power Relay AZ SR131

Cost-effective relays with 4.5 kV dielectric strength and 10 kV surge resistance

New at ZETTLER electronics: 35 AMP Miniature Power Relay AZ SR131

The new AZ SR131 series by ZETTLER

Munich, Germany, April 24th, 2017 – ZETTLER electronics, a manufacturer and distributor of electromagnetic and electronic components, introduces its new AZ SR131 series. The miniature power solar relays are capable of switching up to 35 A at 277 VAC. Coil voltages range from 5 up to 48 VDC. The relay is designed for the use in solar inverter applications according IEC 62109 but can be used in many other applications as well.

The dielectric strength is 4.5 kV between coil/contact. The relays are able to withstand 10 kV surge impulse. In the standard version the AZ SR131 has a contact gap of 1.8 mm and a dielectric strength of 2.5 kV between open contacts. A wide contact gap version (2.3 mm) is also available, with dielectric strength of 3.5 kV between open contacts.

The electric life expectancy is specified with 30,000 cycles at 35 A 277 VAC at an ambient temperature up to 85°C. The relays are available with silver tin oxide SPST-N.O. (1 Form A) contacts. Class F insulation (155° C) is standard.

The AZ SR131 power relays meet RoHS, REACH as well as IEC 61810-1 for the use in low voltage equipment and UL 508 for industrial control panels. Versions compliant to IEC-60335-1 (GWT-Glow Wire Testing) for household appliances are also available.

With UL and TÜV long life ratings, ZETTLER’s 35 AMP Miniature Power Relays are both cost-effective and high performance products. For a complete listing of ZETTLER“s power relay solutions please visit the website. For technical information and datasheets please contact ZETTLER electronics.

More information: AZ SR131 Datasheet

Building on more than a century of expertise in German precision engineering, ZETTLER GROUP is a world-class enterprise, engaged in the design, manufacturing, sales and distribution of electronic components. Its industry leadership is based on a unique combination of engineering competence and global scale. ZETTLER GROUP“s diversified product lines are designed to provide complete solutions for component applications across a broad spectrum of industries, including relays, magnetics, displays, controls and new energy solutions. With a global network of companies ZETTLER GROUP is not only present in low cost manufacturing geographies, but also has the ability to provide customer-focused solutions in proximity to local industrial and commercial markets. Located near Munich, Germany, ZETTLER Electronics GmbH serves as the European headquarters for ZETTLER Group and operates through a comprehensive network of distributors across nineteen countries, including all the key markets of the European Union, Scandinavia, Israel, and Turkey.

Firmenkontakt
ZETTLER electronics GmbH
Alexander Stöckel
Junkersstr. 3
82178 Puchheim (München)
+49 89-800-97-0
Alexander.Stoeckel@ZETTLERelectronics.com
http://www.zettlerelectronics.com

Pressekontakt
Lucy Turpin Communications GmbH
Birgit Fuchs-Laine
Prinzregentenstrasse 89
81675 München
+49 (0)89 – 41 77 61 – 13
zettler@lucyturpin.com
http://www.lucyturpin.com

Electric Electronics

New generation of Debonders and Warpage Adjusters boosts productivity

New generation of Debonders and Warpage Adjusters boosts productivity

MUNICH, April 20, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, is introducing two new innovative products. The systems are targeting the thermal debonding and warpage adjusting in eWLB (embedded Wafer Level Ball Grid Array) processes for 300/330 mm wafer processing. With their innovative features, these machines enable semiconductor manufacturers to increase both throughput and yield.

The ERS ADM330 is designed for the thermal debonding of eWLB style wafers without human intervention at high precision and with unmatched repeatability, resulting in high and predictable process quality and thus guaranteeing high yield. The two handling robots accept wafers with a maximum warpage of +/- 5 mm; after the adjustment step, the warpage is typically less than 500 µm.

With built-in OCR/BCR capabilities, the ERS ADM330 allows for automated exchange of batch parameters with process control systems through its optional SECCS/GEM interface. This enables operators to drive integration into higher-level factory IT systems one step further. Its integrated laser scribing chamber allows for continuous and complete monitoring of production-relevant data.

The ERS WAT 330 is a fully automated warpage adjust tool for 300/330 mm wafers that can handle up to four FOUPs concurrently. With its specially designed proprietary ERS Warpage Adjust Technology, also included in the ADM330, this system can form a wide variety of eWLB wafers at various processing stages. The resulting wafer shape can be matched to the handling specifications of the downstream tool.

Its three operation modes give users of the ERS WAT 330 a maximum of flexibility in high-volume production environments. The system can be used as a warpage measurement station, as a warpage adjust station or as a combined tool to measure, adjust and monitor warpage. In warpage adjust mode, the system can reduce wafer warpage from +/- 5mm to below 500 µm.

Meeting the SEMI E84 interface specifications for factory automation, both systems are future-proof with respect to next-generation digital factory concepts.

ERS electronic GmbH, based in Germering near Munich (Germany), has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de
http://www.brandandimage.de