Impermeable bonding on metal with Low Pressure Moulding through integrated inductive reactivation

productronica 2019: OptiMel Schmelzgußtechnik shows world innovation in Low Pressure Moulding Iserlohn, 15 October, 2019. OptiMel Schmelzgußtechnik GmbH will present a unique system solution for Low Pressure Moulding (LPM) at…

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Battery Management System with Optical Connectivity Ready for Production

KDPOF Will Demo Galvanic Isolation of Gigabit Ethernet POF at IEEE-SA Technology Day and ELIV VDI Congress KDPOF – leading supplier for gigabit transceivers over POF (Plastic Optical Fiber) –…

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Multi-Gigabit Communications Demand New Automotive Standard

KDPOF Drives Efforts for a Scalable Network Technology to Enable High Data Rates of 25 Gbps and beyond As part of a team of automotive companies, Carlos Pardo, CEO and…

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Asahi Kasei Microdevices Introduces Sensor Solutions at PCIM Europe 2019

Düsseldorf, April 23, 2019 – Asahi Kasei Microdevices Corporation (AKM) presents itself at PCIM Europe – the world’s leading exhibition and conference for power electronics, intelligent motion, renewable energy as…

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Best Sound Quality: Asahi Kasei Microdevices to Present Premium Audio Solutions at HIGH END 2019 in Munich

Düsseldorf, April 11, 2019 – From 9 to 12 May 2019, Asahi Kasei Microdevices Corporation, (AKM), will exhibit for the first time at Europe’s leading specialist trade fair for high-quality…

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Embedded World: ARIES Embedded Will Present New System-on-Module with PolarFire FPGA

M100PF Board Enhances and Optimizes Microchip’s PolarFire FPGA for Industrial and Medical Technology ARIES Embedded, specialist for embedded services and products, will display the new M100PF System-on-Module (SoM) based on…

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